The US Department of Commerce’s National Institute of Standards and Technology today launched the first CHIPS for America funding opportunity for manufacturing incentives to “restore U.S. leadership in semiconductor manufacturing, support good-paying jobs across the semiconductor supply chain, and advance U.S. economic and national security.”
Awards will take the form of direct funding, federal loans, and/or federal guarantees of third-party loans. Awards are designed to complement – not replace – private investment and other sources of funding, and applicants are strongly encouraged to bring capital to the table. CHIPS for America awards will be made as soon as applications can be evaluated and negotiated. The automobile industry, of course, has been hobbled by interruptions in its supply of offshore-produced chips or semi-conductors.
The CHIPS and Science Act is part of President Biden’s economic plan to invest in America, stimulating private sector investment, creating good-paying jobs, making more in the United States, and revitalizing communities left behind, Commerce said.
As part of the bipartisan CHIPS and Science Act, the Department of Commerce is overseeing $50 billion to revitalize the U.S. semiconductor industry, including $39 billion in semiconductor incentives. The first funding opportunity seeks applications for projects to construct, expand, or modernize commercial facilities for the production of leading-edge, current-generation, and mature-node semiconductors. This includes both front-end wafer fabrication and back-end packaging. The Department will also be releasing a funding opportunity for semiconductor materials and equipment facilities in the late spring, and one for research and development facilities in the fall.
“The CHIPS and Science Act presents a historic opportunity to unleash the next generation of American innovation, protect our national security, and preserve our global economic competitiveness,” said Secretary of Commerce Gina M. Raimondo. “When we have finished implementing CHIPS for America, we will be the premier destination in the world where new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale and packaged with the most advanced technologies. Throughout our work, we are committed to protecting taxpayer dollars, strengthening America’s workforce and giving America’s businesses a platform to do what they do best: innovate, scale and compete.”
CHIPS for America also today released a “Vision for Success,” laying out strategic objectives building on the vision Secretary Raimondo shared in her speech last week at Georgetown University’s School of Foreign Service. To advance U.S. economic and national security, the Department aims to reach the following goals by the end of the decade: (1) make the U.S. home to at least two, new large-scale clusters of leading-edge logic chip fabs, (2) make the U.S. home to multiple, high-volume advanced packaging facilities, (3) produce high-volume leading-edge memory chips, and (4) increase production capacity for current-generation and mature-node chips, especially for critical domestic industries.
First CHIPS for America Funding Applications Now Open
The US Department of Commerce’s National Institute of Standards and Technology today launched the first CHIPS for America funding opportunity for manufacturing incentives to “restore U.S. leadership in semiconductor manufacturing, support good-paying jobs across the semiconductor supply chain, and advance U.S. economic and national security.”
Awards will take the form of direct funding, federal loans, and/or federal guarantees of third-party loans. Awards are designed to complement – not replace – private investment and other sources of funding, and applicants are strongly encouraged to bring capital to the table. CHIPS for America awards will be made as soon as applications can be evaluated and negotiated. The automobile industry, of course, has been hobbled by interruptions in its supply of offshore-produced chips or semi-conductors.
The CHIPS and Science Act is part of President Biden’s economic plan to invest in America, stimulating private sector investment, creating good-paying jobs, making more in the United States, and revitalizing communities left behind, Commerce said.
As part of the bipartisan CHIPS and Science Act, the Department of Commerce is overseeing $50 billion to revitalize the U.S. semiconductor industry, including $39 billion in semiconductor incentives. The first funding opportunity seeks applications for projects to construct, expand, or modernize commercial facilities for the production of leading-edge, current-generation, and mature-node semiconductors. This includes both front-end wafer fabrication and back-end packaging. The Department will also be releasing a funding opportunity for semiconductor materials and equipment facilities in the late spring, and one for research and development facilities in the fall.
“The CHIPS and Science Act presents a historic opportunity to unleash the next generation of American innovation, protect our national security, and preserve our global economic competitiveness,” said Secretary of Commerce Gina M. Raimondo. “When we have finished implementing CHIPS for America, we will be the premier destination in the world where new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale and packaged with the most advanced technologies. Throughout our work, we are committed to protecting taxpayer dollars, strengthening America’s workforce and giving America’s businesses a platform to do what they do best: innovate, scale and compete.”
CHIPS for America also today released a “Vision for Success,” laying out strategic objectives building on the vision Secretary Raimondo shared in her speech last week at Georgetown University’s School of Foreign Service. To advance U.S. economic and national security, the Department aims to reach the following goals by the end of the decade: (1) make the U.S. home to at least two, new large-scale clusters of leading-edge logic chip fabs, (2) make the U.S. home to multiple, high-volume advanced packaging facilities, (3) produce high-volume leading-edge memory chips, and (4) increase production capacity for current-generation and mature-node chips, especially for critical domestic industries.