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Biden Administration – $1.6B in Semiconductor Manufacturing
The US Department of Commerce today published a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities that it said will establish and accelerate domestic capacity for semiconductor advanced packaging. The CHIPS for America program predicts that up to $1.6 billion in funding will go to five R&D areas. These were first outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP). Through potential cooperative agreements, CHIPS for America would make several awards of ~$150 million federal funding per award in each research area. Continue reading →