-
Recent Posts
- EPA Publishes New Kids and Climate Health Zone
- ChargeScape Vehicle-Grid Integration JV Begins Operations
- GM Canada Has Tentative Unifor Agreement at CAMI Assembly
- Shawn Fain to Speak to Stellantis UAW Membership Tonight
- DOJ – Defeat Devices Plea With COBB Tuning Products
- Best Selling Car Now at Dealerships – 2025 Honda Accord
- Software Recall on 2024 Porsche Taycans
- Mazda Software Recall on Forward Sensing Camera
- Annals of Marketing – Shohei Ohtani and Taycan Turbo S
- McLaren P1 $449.99! Some Assembly Required
- Strange Clean Energy Bedfellows – GM and Hyundai
- Stellantis to Invest +$406M in Three Michigan Plants for EVs
- Volkswagen Group Recalls 2021-2024 ID.4 Models
- North Carolina Parts Seller Fined for Emission Defeat Devices
- Manheim – U.S. Wholesale Used Vehicle Prices Up In August
Recent Comments
- Ford Motor on Ford Reveals 2025 Bronco Sport – Sasquatch Off-Road Option
- Lana Payne on Ford EVs and Quality Damage First Half Net Income and EPS
- UAW on President Biden Passing the Torch to a New Generation on Donald Trump is a Scab – UAW Endorses President Biden
- Yen Chen - Center for Automotive Research on Biden Administration Chinese Trade War Tariffs Start August 1
- Ken Zino on Ford Motor Posts Q1 2024 Net Income of $1.3 Billion
Archives
Meta
Biden Administration – $1.6B in Semiconductor Manufacturing
The US Department of Commerce today published a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities that it said will establish and accelerate domestic capacity for semiconductor advanced packaging. The CHIPS for America program predicts that up to $1.6 billion in funding will go to five R&D areas. These were first outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP). Through potential cooperative agreements, CHIPS for America would make several awards of ~$150 million federal funding per award in each research area. Continue reading →