Tag Archives: Honda and IBM

“The MOU outlines areas of potential joint research of specialized semiconductor technologies such as brain-inspired computing *[2 ] and chiplet technologies, with the aim to dramatically improve processing performance while, simultaneously, decreasing power consumption. Hardware and software co-optimization is important to ensure high performance and fast time to market. To achieve such benefits and manage design complexity for future SDVs, the two companies also plan to explore open and flexible software solutions,” Honda said in a release from Tokyo. Continue reading →