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Tag Archives: Renesas Electronics
Renesas and Nidec Announce New EV E-Axle Systems
Renesas Electronics Corporation (TSE: 6723)* today announced what it claims is the world’s first “8-in-1” proof of concept (PoC) for E-Axle systems for electric vehicles. It controls eight functions using a single microcontroller (MCU). Developed in collaboration with Nidec Corporation, this PoC integrates a motor, a reduction gear, an inverter, a DC/DC converter, and an on-board battery charger (OBC). System-level testing was also completed to ensure its performance. This of course awaits verification in deployments on the road.
“The E-Axle is a unit in EVs that combines a drive motor, a gear, and an inverter. By integrating multiple functions, the E-Axle system can reduce system size and weight, simplifying EV design. Renesas provided key components, including semiconductors and a reference design for the new 8-in-1 E-Axle system. Renesas also plans to deliver turnkey semiconductor solutions for various X-in-1 systems based on the reference design verified through this PoC. Armed with these solutions, developers can implement and evaluate X-in-1 systems instantly, accelerating EV development,” Renesas said. Continue reading
Posted in auto news, electric vehicles, electronics, engineering, milestones, news analysis, transportation
Tagged auto industry commentary, autoinformed.com, automotive blog, Automotive news and analysis, Chris Allexandre, Ken Zino, Nidec, Renesas Electronics, Ryuji Omura, TSE: 6723, X @KenAutoinformed
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Honda Expands Work with Renesas Electronics for ADAS
Now Honda has selected R-Car and RH850 for use in the Honda SENSING 360 omnidirectional safety and driver assistance system, which builds on the knowledge and expertise gained through research and development work on the earlier technology. The first automobile model equipped with Honda SENSING 360 is scheduled for release in China in 2022, with adoption in a broader range of models to follow. Continue reading

Renesas Electronics Shows New Bluetooth Chip
Renesas Electronics Corporation (TSE: 6723) today introduced a new Bluetooth chip that combines a radio transceiver, an Arm® M0+ micro-controller, memory, peripherals and security features in a compact SoC (system on a chip) design.*
“The DA14533, the first automotive-qualified device in the company’s Bluetooth® Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption,” Renesas said. Continue reading →